Thin Wafer Transport Device 'TWH150/200/300'
Transfer machines suitable for the transport and automation of compound semiconductor wafers.
The "TWH150/200/300" enables fully automated transfer and refilling between cassettes, from cassette to pod, from pod to cassette, and from pod to pod, as an independent transfer device compatible with ultra-thin wafers. It can fully automate the transport of thin wafers as an integrated module system with analytical instruments and process equipment. It is also suitable for the transport and automation of MEMS wafers and compound semiconductor wafers, which require non-contact transport, not limited to thin or silicon wafers. [Features] - Compatible with ultra-thin wafers - Enables fully automated refilling transport - Suitable for automation *For more details, please refer to the PDF document or feel free to contact us.
- Company：デリクソンテクノロジージャパン
- Price：Other
